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Product information

Assembly Capability

Production Overview


Wafer diameter Max:12inch Saw street size Min:60um
Die size Package type Max die size(X*Y)
TO-220FB-3L 5800×4600(um2)
TO-220C-3L 6000×4600(um2)
TO-220HJ-3L 6400×4460(um2)
TO-220AB/263 6300×4800(um2)
TO-262 6620×3900(um2)
TO-220/263NB 4820×2320(um2)
TO-220MF/SF/HF/LF-3L 6300×5400(um2)
DPAK/IPAK系列 4000×2900(um2)
TO-3P 9800×7100(um2)
TO-247-2/3L 11000×6616(um2)
TO-264 13500×10750(um2)
bonding wire Aluminum wire 3~20mil Gold and copper wire 25~75um

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